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Ideal IC packing units; allowing easier adhering and component assembly of COF, TCP, and CMOS, as well as for the easy carrying and transportation of printed wiring
Available in low-hardness (low-molecular polysiloxane) and high-hardness (self-adhesive silicon rubber) models
Adhesion types: Designed for all-flat adhesion and partial adhesion. Adhesion adjustable per customer request
Heat resistance: Can resist temperatures of up to 265°C (300°C with special design), meeting non-lead production process requirements
High self-adhesion and easy unloading: Allow circuit boards to be easily unloaded from or adhered to the carriers, saving labor and enhancing efficiency
For repetitive use: Self-adhesion force will not weaken under high-temperature baking, simplifying operating procedures and costs
No residual sericin: Ensure neither residual sericin left nor falling off of sericin after unloading